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[Test Case] Strength Evaluation of DLC Ultra-Thin Films

Detailed explanation of test results using multi-angular alumina particles of 1.2µm.

We would like to introduce a case where the strength of a hard, thin DLC film on a very soft Si wafer was evaluated without being influenced by the substrate. As a result, it was found that the erosion rate of the ultra-thin film was 0.002µm/g, and the strength was almost constant in both the three test areas and the depth direction. 【Case Summary】 ■Objective - Identification of the strength of hard ultra-thin films - Identification of the thickness of ultra-thin films - Exploration of the measurement capability of hard films on soft substrates ■Evaluation - It was found that the film thickness varied by area and matched the optical interference colors - Visualization of changes in strength at the interface, etc. *For more details, please refer to the PDF document or feel free to contact us.